Direct adhesive process
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United States of America Patent
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-
Sep 21, 1999
Grant Date -
N/A
app pub date -
Feb 28, 1997
filing date -
Feb 28, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Process of adhering conductors such as bare copper wire, copper wire with polymide insulation, and multistrand Kapton wrapped superconductors to mount structures such as a cylinder of arbitrary cross sections, a saddle support, or steel tubes using adhesive layers of material such as BONDALL 16-H, 3M-2090 and T-164. The adhesive layers are subject to b-staging before being used, where it is heated to a temperature of approximately 60-100.degree. C. for approximately 1/2 hour to approximately one hour. The support surface can optionally be grooved to allow for better wire placement and no wire slippage.
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