Automatic film deposition control
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United States of America Patent
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Sep 21, 1999
Issued Date -
N/A
app pub date -
Jul 18, 1997
filing date -
May 3, 1995
priority date (Note) -
Expired
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Abstract
A film deposition control system and method in which a deposition rate monitor and an ellipsometer are used to control the thickness of a thin film being deposited on a wafer. The ellipsometer is also used to detect the refractive index of the thin film being deposited, and the detected refractive index value is used to control the ratio of the reactive gases being injected into the processing chamber.
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