Low volatility solvent-based method for forming thin film nanoporous aerogels on semiconductor substrates

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United States of America Patent

PATENT NO 5955140
SERIAL NO

08746680

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Abstract

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This invention has enabled a new, simple thin film nanoporous dielectric fabrication method. In general, this invention uses glycerol, or another low volatility compound, as a solvent. This new method allows thin film aerogels/low density xerogels to be made without supercritical drying, freeze drying, or a surface modification step before drying. Thus, this invention allows production of nanoporous dielectrics at room temperature and atmospheric pressure, without a separate surface modification step. Although this new method allows fabrication of aerogels without substantial pore collapse during drying, there may be some permanent shrinkage during aging and/or drying. This invention allows controlled porosity thin film nanoporous aerogels to be deposited, gelled, aged, and dried without atmospheric controls. In another aspect, this invention allows controlled porosity thin film nanoporous aerogels to be deposited, gelled, rapidly aged at an elevated temperature, and dried with only passive atmospheric controls, such as limiting the volume of the aging chamber.

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Patent Owner(s)

Patent OwnerAddress
TEXAS INSTRUMENTS INCORPORATED12500 TI BOULEVARD MS 3999 DALLAS TX 75243

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ackerman, William C Albuquerque, NM 21 1173
Gnade, Bruce E Dallas, TX 69 3514
Jeng, Shin-Puu Plano, TX 851 18082
Johnston, Gregory P Albuquerque, NM 8 220
Maskara, Alok Albuquerque, NM 8 224
Ramos, Teresa Albuquerque, NM 39 840
Smith, Douglas M Albuquerque, NM 118 4298
Stoltz, Richard A Plano, TX 41 2354

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