Conductive circuit board and method for making
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United States of America Patent
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-
Sep 21, 1999
Grant Date -
N/A
app pub date -
Nov 19, 1997
filing date -
Nov 20, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A conductive circuit board is prepared by forming a film of organopolysilane having a H-Si bond on a substrate, selectively exposing the organopolysilane film to light to form a photo-crosslinked layer in exposed areas, dissolving away unexposed areas, and contacting a silver salt with the photo-crosslinked layer and reducing the silver salt to form a silver conductive layer thereon. A conductive circuit board comprising a circuit-patterned film of photo-crosslinked polymer on a substrate and a silver conductive layer on the film has high and stable electric property.
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