High density single inline memory module
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United States of America Patent
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Sep 21, 1999
Grant Date -
N/A
app pub date -
Dec 19, 1997
filing date -
Dec 19, 1997
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A high density single inline memory module (140) comprising a printed circuit board (132) and at least one integrated circuit module (130) attached to the first side (134) of the printed circuit board (132), wherein the integrated circuit modules (130) each including first and second integrated circuit packages (30) stackably and electrically connected together is disclosed.
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