Method and structure for a surface mountable rigid-flex printed circuit board
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United States of America Patent
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Sep 21, 1999
Grant Date -
N/A
app pub date -
Jan 20, 1998
filing date -
Jan 20, 1998
priority date (Note) -
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Abstract
A method and structure for a surface mountable rigid-flex printed circuit board is disclosed. A rigid-flex circuit board is mounted onto a printed circuit board using standard surface mount technology such as ball grid array, pin grid array or solder screen print. The use of rigid-flex board allows tested, burned in components to be used while still allowing a small multiple chip module footprint.
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