IC leadframe processing system
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United States of America Patent
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Sep 28, 1999
Grant Date -
N/A
app pub date -
Nov 18, 1997
filing date -
Dec 3, 1996
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An IC leadframe processing system for use in an IC manufacturing system, whereby IC leadframes of different types can be subjected to various lead machining processes by a single processing system without a need of various types of cutting and bending dies. The topmost leadframe is separated by a separating device one by one from a stack of leadframes stored, each having a plurality of IC chips connected thereto. The leadframe is cut into each individual packaged IC by a leadframe cutting device. Lead wires of each packaged IC are subjected to pinch cutting, dam cutting and end cutting by a cutting die and then bent into a Z shape by a bending machine.
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