Integrated solder preform array having a tin outer coating
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United States of America Patent
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Sep 28, 1999
Grant Date -
N/A
app pub date -
Jun 10, 1996
filing date -
Jun 10, 1996
priority date (Note) -
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Abstract
An integrated solder preform array is composed of a metal or metal alloy suitable for use in a soldering or bonding process. The preform includes a series of discrete solder islands disposed in a desired matrix. Each island contains a hole for receiving a pin, and bridging strands for joining each of said islands in a matrix. The bridging strands are formed of the same solder material as the islands, with the solder preform containing a substantially uniform coating of tin over its entire outer surface for the purpose of improving solder wetting and therefore elimination of unwanted shorting of circuits and other electrical components being soldered.
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