Method of modifying an exposed surface of a semiconductor wafer
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 28, 1999
Issued Date -
N/A
app pub date -
Aug 8, 1996
filing date -
Sep 22, 1995
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of modifying an exposed surface of a semiconductor wafer that includes the steps of: (a) contacting the surface with a fixed abrasive article having a three-dimensional textured abrasive surface that includes a plurality of abrasive particles and a binder in the form of a pre-determined pattern; and (b) relatively moving the wafer and the fixed abrasive article to modify said surface of the wafer.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully