Connection components with rows of lead bond sections
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United States of America Patent
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-
Sep 28, 1999
Issued Date -
N/A
app pub date -
Apr 8, 1998
filing date -
Jul 7, 1994
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A connection component for a microelectronic element includes a sheet-like support structure having top and bottom surfaces which extend in horizontal directions. The support structure includes a central region and a periphery surrounding the central region with terminals mounted on the central region of the support structure and exposed at the top surface thereof. A plurality of leads extend on the support structure with each lead having a terminal section connected to one of the terminals and attached to the bottom surface, a bond region and a horizontally curved section between the bond region and the terminal region. The bond regions of the leads are disposed side-by-side in one or more rows adjacent the periphery of the support structure. After the bond regions of the leads have been bonded to contacts of a microelectronic element, the support structure of the connection component is moveable upwardly so as to bend the curved sections of the leads.
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