Surface mount assembly for incandescent lamps and other electrical components
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Sep 28, 1999
Grant Date -
N/A
app pub date -
Apr 2, 1997
filing date -
Apr 2, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A surface mount assembly. The assembly includes an elongated sealed envelope, such as an incandescent lamp with a filament positioned in the envelope, first and second leads extending from the spaced ends of the envelope and a metal material applied to the second leads. The leads and metal are configured to form a pair of electrically conductive mounting members at the ends of the envelope for mounting the envelope to a circuit board.
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Cited Art Landscape
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