Substrate treating method and apparatus
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United States of America Patent
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Oct 5, 1999
Grant Date -
N/A
app pub date -
Sep 8, 1998
filing date -
Sep 25, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A substrate treating method and apparatus for treating a substrate by supplying a developing solution thereto while spinning the substrate. A nozzle having a plurality of discharge openings for discharging the developer is disposed such that the discharge openings are at different distances from the spin center of the substrate. The developer is discharged from the nozzle while the latter is moved radially of the substrate. The discharge openings then describe loci not overlapping one another over the substrate. The developer is evenly supplied over the substrate to promote the uniformity of development on the substrate surface.
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