Encapsulated implantable transponder
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United States of America Patent
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Oct 5, 1999
Grant Date -
N/A
app pub date -
Oct 11, 1996
filing date -
Oct 11, 1996
priority date (Note) -
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Abstract
An EID or RFID transponder having an encapsulant with an open end to allow insertion of the transponder circuitry and a phase changing material such as an epoxy used to both secure the circuitry of the transponder within the encapsulant and seal the open end of the encapsulant.
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