Asymmetrical scribe and separation method of manufacturing liquid crystal devices on silicon wafers
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United States of America Patent
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Oct 5, 1999
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app pub date -
Oct 27, 1997
filing date -
Oct 27, 1997
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Abstract
A method of manufacturing liquid crystal on silicon devices uses asymmetric placement of scribes on silicon and glass substrate layers to maximize the yield of processed active matrix silicon wafers. Asymmetrical scribing minimizes a dimension from a gasket seal between the substrates to a lower bond pad edge. An opposite glass overhang provides an interconnect redundancy for an ITO plate or a repair site for electrical contact to the ITO plate. Methods of device separation employing partial sawing are also employed.
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