Inspection system and method for bond detection and validation of surface mount devices
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United States of America Patent
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Oct 5, 1999
Grant Date -
N/A
app pub date -
Nov 20, 1996
filing date -
Aug 7, 1996
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A hybrid surface mount component inspection system which includes both vision and infrared inspection techniques to determine the presence of surface mount components on a printed wiring board, and the quality of solder joints of surface mount components on printed wiring boards by using data level sensor fusion to combine data from two infrared sensors to obtain emissivity independent thermal signatures of solder joints, and using feature level sensor fusion with active perception to assemble and process inspection information from any number of sensors to determine characteristic feature sets of different defect classes to classify solder defects.
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