Tungsten skeleton structure fabrication method employed in application of copper infiltration and tungsten-copper composite material fabrication method thereof
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United States of America Patent
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Oct 5, 1999
Grant Date -
N/A
app pub date -
Jun 12, 1998
filing date -
Jun 14, 1997
priority date (Note) -
Expired
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Abstract
A tungsten skeleton structure fabrication method employed in an application of a copper infiltration and tungsten-copper composite fabrication method includes the steps of forming a source powder by coating the tungsten powder surface having a purity of 99.9 weight percent and 2.about.5 .mu.m in size, with nickel by less than 0.06 weight percent (600 ppm), forming an injection molded admixture by admixing a source powder and a polymer binder, carrying out a powder injection molded with regard to the admixture, and obtaining a tungsten skeleton structure by removing the polymer binder from the resultant injection molded body. The method prevents the molded body from being unevenly shrunken during a liquid phase sintering for thereby decreasing its production cost.
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