Method for using ultrasonic treatment in combination with UV-lasers to enable plating of high aspect ratio micro-vias
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United States of America Patent
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Oct 12, 1999
Grant Date -
N/A
app pub date -
Nov 8, 1996
filing date -
Nov 8, 1996
priority date (Note) -
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Abstract
A method of forming a via in a laminated substrate by forming ablated material by laser drilling a via in a laminated substrate. The ablated material is deposited on a sidewall of the via. An ultrasonic treatment is applied to the drilled substrate thereby removing ablated material redeposited on sidewalls of the via.
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