Method of making cathode targets comprising silicon
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United States of America Patent
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Oct 12, 1999
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N/A
app pub date -
Apr 2, 1993
filing date -
Apr 2, 1993
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Abstract
A method for bonding silicon-containing compositions to metal surfaces is disclosed wherein a coarse silicon-containing surface is arc-sprayed with a first adhesive layer, a second solderable layer, and a third solder layer, and the arc-sprayed surface is then soldered to the metal surface. The method is particularly useful for producing silicon-containing targets for cathode sputtering.
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