Importance

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Abstract

A cleaning apparatus is used for cleaning a thin disk-shaped workpiece such as a semiconductor wafer, a liquid crystal display or the like. The cleaning apparatus comprises a support mechanism for supporting a workpiece and rotating the workpiece about its own axis, and a cleaning member for being in sliding contact with at least one of opposite surfaces of the workpiece. The support mechanism comprises a plurality of spindles, and a plurality of rotatable holding portions provided on upper ends of the spindles and having respective circumferential edges engageable with a circumferential edge of the workpiece. The plurality of spindles are clustered into groups around the workpiece, and two adjacent groups of the spindles are positioned to form a wide spacing between two adjacent groups of the spindles, and a path along which the workpiece is supplied to and removed from the support mechanism is positioned in the wide spacing.

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First Claim