Importance

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Abstract

A method and apparatus for cleaning a semiconductor wafer. The apparatus preferably includes a brush holder that may include a base and a connection stud extending from the base. The base preferably includes a first plurality of openings and a receiving lip for receiving a brush that is disposed on its lower surface. The openings preferably serve to pass a cleaning solution to the brush during cleaning of a semiconductor wafer. The brush preferably includes a substantially flexible material and a plurality of protrusions for contacting a semiconductor wafer. A backing plate preferably is attached to one side of the brush for connecting the brush to the brush holder. The backing plate preferably includes a plurality of openings arranged to match the first plurality of openings on the base of the brush holder. The backing plate preferably further includes an outer edge capable of forming a snap-fit engagement within the receiving lip of the brush holder to: (a) facilitate periodic replacement of the brush and (b) form a mechanical connection between the brush and brush holder that can withstand the presence of relatively basic or acidic cleaning agents.

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First Claim