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Abstract

An apparatus for performing a global planarization of a surface of a deformable layer of a wafer on a production scale. The apparatus includes a chamber having a pressing surface and containing a rigid plate and a flexible pressing member or 'puck' disposed between the rigid plate and the pressing surface. A wafer having a deformable outermost layer is placed on the flexible pressing member so the deformable layer of the wafer is directly opposite and substantially parallel to the pressing surface. Force is applied to the rigid plate which propagates through the flexible pressing member to press the deformable layer of the wafer against the pressing surface. Preferably, a bellows arrangement is used to ensure a uniformly applied force to the rigid plate. The flexible puck serves to provide a self adjusting mode of uniformly distributing the applied force to the wafer ensuring the formation of a high quality planar surface. The surface of the wafer assumes the shape of the pressing surface and is hardened in a suitable manner while under pressure to produce a globally planarized surface on the wafer. After the force is removed from the rigid plate, lift pins are slidably inserted through the rigid plate and the flexible pressing member to lift the wafer off of the surface of the flexible pressing member.

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First Claim