Mechanism and method for cleaning probe needles
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United States of America Patent
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Oct 19, 1999
Grant Date -
N/A
app pub date -
Nov 5, 1998
filing date -
Nov 10, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A cleaning mechanism and method for cleaning the probe needles of a probe card used for the inspection of the electric characteristics of a wafer W. This mechanism is provided with a soft cleaner and a brush cleaner. The soft cleaner has a cleaner layer formed of rubber and inorganic filler. The brush cleaner has a number of brush sections, and each brush section is a bundle of fiber members. The fiber members are thinner than the probe needles and have a certain degree of elasticity. The cleaning method includes the steps of: a) cleaning the probe needles using the soft cleaner having a the cleaning layer made of rubber and inorganic filler and b) cleaning the probe needles using the brush cleaner having bristles.
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