Process for treating a lithographic substrate and a rinse solution for the treatment
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United States of America Patent
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Oct 19, 1999
Grant Date -
N/A
app pub date -
Dec 24, 1997
filing date -
Dec 27, 1996
priority date (Note) -
Expired
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Abstract
This invention relates to a process for rinsing a substrate which has been provided with a desired resist pattern and subjected to an etching treatment, and optionally, subsequent ashing treatment, said process including the steps of: (I) treating said resist pattern with a remover solution which contains, as a principal ingredient, a salt of hydrofluoric acid and a metallic-ion-free base; (II) rinsing said substrate with a rinse solution for lithography which contains ethylene glycol and/or propylene glycol, and a water-soluble organic solvent other than said glycol; and (III) washing said substrate with water.
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