Epoxy-containing die-attach compositions
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United States of America Patent
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Oct 19, 1999
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N/A
app pub date -
Jun 20, 1997
filing date -
Jun 20, 1997
priority date (Note) -
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Abstract
In accordance with the present invention, there are provided novel compositions for attaching semiconductor devices to substrates. Invention compositions comprise liquid monomer vehicle comprising hydrophobic cyanate ester monomer(s) and epoxy monomer(s), electrically and/or thermally conductive filler, a metal catalyst, and an imidazole, preferably in the substantial absence of non-reactive diluents.
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