Semiconductor package with molded plastic body
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United States of America Patent
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-
Oct 19, 1999
Grant Date -
N/A
app pub date -
May 25, 1994
filing date -
May 25, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
There is provided a leadframe assembly for encapsulation in a polymer resin which prevents post-assembly fracture or swelling of the resin. The leadframe is coated with an adhesion enhancing layer that increases the shear stress required for delamination to in excess of about 3.4 MPa. In combination with this adhesion enhancing layer is a compliant die attach adhesive bonding an integrated circuit device to a central die attach paddle. This compliant die attach adhesive has a compliancy factor, E.multidot.a of less than 1.5 MPa/.degree.C. and a thickness of from about 0.01 mm to about 0.08 mm.
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