Substrateless resin encapsulated semiconductor device
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United States of America Patent
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Oct 19, 1999
Grant Date -
N/A
app pub date -
Dec 13, 1995
filing date -
Dec 14, 1994
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor device includes an encapsulating resin encapsulating a semiconductor substrate, a lead pattern or a laminated wiring layers transferred or secured on the lower surface of the encapsulating resin and a plurality of external electrode disposed on the lower surface of the lead pattern. The device may be manufactured by bonding a semiconductor substrate on a transferring substrate to which a lead pattern is formed, resin encapsulating an upper portion of the transferring substrate to cover the semiconductor substrate, and removing only the transferring substrate with the lead pattern left bonded to the encapsulating resin and the semiconductor substrate.
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