Alignment mark, manufacturing method thereof, exposing method using the alignment mark, semiconductor device manufactured using the exposing method
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United States of America Patent
Stats
-
Oct 19, 1999
Issued Date -
N/A
app pub date -
May 29, 1998
filing date -
Sep 30, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An alignment mark formed on a surface of substrate for aligning with a mask through an irradiation of alignment light, which comprises a step formed with a concave portion and a convex portion and a metallic film deposited along the concave portion and the convex portion. A light absorption layer is formed over at least one of the concave portion and the convex portion reflecting the step, the light absorption layer lying over the concave portion having a different thickness from that of the light absorption layer lying over the convex portion when the light absorption layer is formed over both the concave portion and the convex portion, the light absorption layer comprising a material capable of absorbing at least a portion of wavelength region of the alignment light. The light absorption layer is desirably formed in a larger thickness on the convex portion of the step as compared with that on the concave portion. Desirably, the light absorption layer is a resist capable of absorbing a portion of wavelength region of the alignment light, or a resist containing a material capable of absorbing a portion of wavelength region of the alignment light.
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