Electrostatic wafer clamp having low particulate contamination of wafers
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United States of America Patent
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Oct 19, 1999
Grant Date -
N/A
app pub date -
Apr 10, 1998
filing date -
Apr 10, 1998
priority date (Note) -
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Abstract
Apparatus for electrostatic clamping of a workpiece, such as a semiconductor wafer, includes a platen assembly defining an electrically-insulating clamping surface for receiving the workpiece. The platen assembly includes electrodes underlying and electrically isolated from the clamping surface and a dielectric layer between the electrodes and the clamping surface. The dielectric layer may have a periphery which is beveled to define a blunt first edge that forms a boundary of the clamping surface and a second edge that is spaced from the workpiece. A thin, low friction, high hardness dielectric coating may be provided over the dielectric layer. The electrodes may be fabricated of niobium. The disclosed electrostatic wafer clamp provides excellent performance with respect to particulate contamination of the workpiece.
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