Heating device for semiconductor wafers
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United States of America Patent
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Oct 19, 1999
Grant Date -
N/A
app pub date -
May 14, 1998
filing date -
May 14, 1998
priority date (Note) -
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Abstract
An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly of light energy sources for emitting light energy onto a wafer. In particular, the light energy sources are positioned such that many different radial heating zones are created on a wafer being heated. The light energy sources form concentric rings. Tuning light sources are then placed in between the concentric rings of light.
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