Microelectronic component mounting with deformable shell terminals
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United States of America Patent
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Oct 26, 1999
Issued Date -
N/A
app pub date -
Dec 27, 1996
filing date -
Jul 31, 1995
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A microelectronic element assembly such as a semiconductor chip assembly uses a connection component incorporating a dielectric sheet with electrically conductive elements therein. Each electrically conductive element may include a flexible shell. The flexible shells can be formed to assure reliable engagement with mating contact pads.
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