Methods for treating semiconductor wafers
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United States of America Patent
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Oct 26, 1999
Grant Date -
N/A
app pub date -
Jun 12, 1998
filing date -
Jun 13, 1997
priority date (Note) -
Expired
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Abstract
The present invention presents methods for, inter alia, cleaning and etching semiconductor wafers with a solution containing ammonium fluoride and control of the process used for preparing such a solution at its point of use.
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