Pulse electroplating copper or copper alloys
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United States of America Patent
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Oct 26, 1999
Grant Date -
N/A
app pub date -
Jul 23, 1997
filing date -
Jul 23, 1997
priority date (Note) -
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Abstract
High aspect ratio openings in excess of 3, such as trenches, via holes or contact holes, in a dielectric layer are voidlessly filled employing a pulse or forward-reverse pulse electroplating technique to deposit copper or a copper-base alloy. A leveling agent is incorporated in the electroplating composition to ensure that the opening is filled substantially sequentially from the bottom upwardly.
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