Method of manufacturing a planar coil using a transparency substrate
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United States of America Patent
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Oct 26, 1999
Grant Date -
N/A
app pub date -
Oct 10, 1997
filing date -
Oct 10, 1997
priority date (Note) -
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Abstract
The present invention uses a glass to act as a substrate. A stencil layer is patterned on the top surface of the substrate. Successively, a copper layer is deposited over the substrate. Next step is to remove the stencil layer. A negative photoresist layer is formed on the copper layer. A negative photoresist layer is processed using a backside exposure of the resist through the transparent substrate. The backside exposure technique uses the self-aligning, conductive copper layer as a mask. A plurality of trenches are then created in the photoresist layer and a second copper layer is electroplated in the trenches to form the planar coils.
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