Method of manufacturing a tab semiconductor device
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United States of America Patent
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Oct 26, 1999
Issued Date -
N/A
app pub date -
Mar 13, 1998
filing date -
Apr 28, 1995
priority date (Note) -
Expired
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Abstract
A resin-encapsulated semiconductor device includes a semiconductor chip consisting of a semiconductor element having metal bumps and metal leads electrically connected to the metal bumps and having a surface-treated layer obtained by a surface treatment, and a resin film stacked on the outer side of the semiconductor chip and tightly adhered to the semiconductor chip by a heat treatment and pressurization treatment.
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