Method for producing semiconductor chips
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United States of America Patent
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Oct 26, 1999
Grant Date -
N/A
app pub date -
Sep 30, 1997
filing date -
Sep 30, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Semiconductor chips are produced from a wafer. The semiconductor chips are separated from one another by etching the wafer all the way through, by a dry etching process, in defined separation zones between the semiconductor chips. Initially, first etching trenches for separating the p-n junctions are etched into the wafer. Then, second etching trenches are etched from the opposite side of the wafer until the individual semiconductor chips are completely separated.
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