Stacked carrier three-dimensional memory module and semiconductor device using the same
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United States of America Patent
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Oct 26, 1999
Grant Date -
N/A
app pub date -
Mar 3, 1998
filing date -
Apr 2, 1997
priority date (Note) -
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Abstract
A three-dimensional memory module includes a plurality of semiconductor device units, every adjacent two of which are stack-connected via through-holes by a bump connecting method. Each of the plurality of semiconductor device units includes a carrier having a circuit pattern and the through-holes connected to the circuit pattern. The semiconductor device unit also includes at least one semiconductor memory chip mounted on the carrier such that the semiconductor memory chip is connected to the circuit pattern, and at least one chip select semiconductor chip mounted on the carrier to be connected to the circuit pattern such that the chip select semiconductor chip can select the semiconductor memory chip.
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