Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
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United States of America Patent
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Oct 26, 1999
Issued Date -
N/A
app pub date -
Aug 19, 1997
filing date -
Nov 20, 1996
priority date (Note) -
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Abstract
An inventive electronic device, such as a multi-chip module (MCM), a Single In-line Memory Module (SIMM), or a Dual In-line Memory Module (DIMM), includes a base, such as a printed circuit board, having a surface on which flip-chip pads and wire-bondable pads are provided. The flip-chip pads define an area on the surface of the base at least partially bounded by the wire-bondable pads. A first integrated circuit (IC) die is flip-chip bonded to the flip-chip pads, and a second IC die is back-side attached to the first IC die and then wire-bonded to the wire-bondable pads. As a result, the flip-chip mounted first IC die is stacked with the second IC die in a simple, novel manner.
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