Cooling process system
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 2, 1999
Grant Date -
N/A
app pub date -
Aug 29, 1997
filing date -
Sep 2, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The process system of the present invention has a cooling process portion, a siding portion, and transfer means. The cooling process portion is responsible for applying cooling process to a heated substrate. The siding portion is positioned in an upper side of the cooling process portion and used for temporarily storing the substrate before being subjected to the cooling process. The transfer means loads/unloads the substrate into/from the cooling process portion and the siding portion.
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