Apparatus, method and medium for enhancing the throughput of a wafer processing facility using a multi-slot cool down chamber and a priority transfer scheme

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5975740
SERIAL NO

08654370

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An apparatus, method and medium is provided for increasing the efficiency with which wafers are transferred among different processing chambers in a wafer processing facility. A multi-slot cooling chamber allows multiple wafers to be cooled while other wafers are subjected to processing steps in other chambers. Each wafer in the processing sequence is assigned a priority level depending on its processing stage, and this priority level is used to sequence the movement of wafers between chambers. A look-ahead feature prevents low-priority wafer transfers from occurring if such transfers would occur just prior to the scheduling of a high-priority wafer transfer.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
APPLIED MATERIALS, INC.SANTA CLARA, CA5616

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lin, Zhihong J Sunnyvale, CA 5 138
Wang, Chongyang San Jose, CA 26 400

Cited Art Landscape

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Patent Citation Ranking

Forward Cite Landscape

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