Removal of fluorine or chlorine residue by liquid CO.sub.2

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United States of America Patent

PATENT NO 5976264
SERIAL NO

09201459

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Abstract

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A method for the removal of fluorine or chlorine residue from an etched precision surface such as a semiconductor sample is provided which comprises exposing said precision surface to liquid CO.sub.2 under appropriate conditions that are sufficient to remove the residue from the precision surface. Cryogenic aerosol may be used in conjunction with liquid CO.sub.2.

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Patent Owner(s)

Patent OwnerAddress
INTERNATIONAL BUSINESS MACHINES CORPORATIONARMONK NEW YORK 10504

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
McCullough, Kenneth John Fishkill, NY 24 504
Purtell, Robert Joseph Mohegan Lake, NY 5 240
Rothman, Laura Beth South Kent, CT 2 205
Wu, Jin-Jwang Fishkill, NY 2 205

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