Method of forming a molded, multi-layer structure

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United States of America Patent

PATENT NO 5976288
SERIAL NO

08781205

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Abstract

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A method of forming a molded, multi-layer structure begins with a pre-laminated, multi-layer structure having a thermoplastic substrate layer and a cover layer. One or more optional layers laminated may be provided between the cover layer and substrate layer. Thermoplastic materials are selected having various physical characteristics (e.g. degrees of cross-linking) to produce a molded structure having a desired shape, rigidity, hardness/softness, and other physical properties. All of the multiple layers can be made of thermoplastic materials having the same polymers to allow the molded structure to be recycled into a reusable thermoplastic material. The pre-laminated, multi-layer structure is uniformly heated, by a method which provides heat penetration and absorption substantially throughout the multi-layer structure. During thermoforming, such as with male/female molds or vacuum molds, the thickness and rigidity of the multi-layer structure can be varied. A textured or decorative surface can be pre-formed in the cover layer(s) or formed during the thermoforming process.

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Patent Owner(s)

Patent OwnerAddress
EKENDAHL LARS ONot Provided

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ekendahl, Lars O 10 Gunstock Drive, Kingston, SE 3 64

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