Composition for electroplating palladium alloys and electroplating process using that composition
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United States of America Patent
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Nov 2, 1999
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app pub date -
Nov 19, 1997
filing date -
May 10, 1996
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Abstract
An aqueous electroplating bath for the electrodeposition of palladium alloys in a mixed ligand system. A first ligand operates to form a complex of palladium and a second ligand functions to form a complex of another metal which brings the plating potentials of the two metals closer together. Palladium and the alloying metal thus exist as complexes with different structures.
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