Three dimensional processor using transferred thin film circuits
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United States of America Patent
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-
Nov 2, 1999
Issued Date -
N/A
app pub date -
Dec 8, 1997
filing date -
Sep 30, 1993
priority date (Note) -
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Abstract
A multi-layered structure is fabricated in which a microprocessor is configured in different layers and interconnected vertically through insulating layers which separate each circuit layer of the structure. Each circuit layer can be fabricated in a separate wafer or thin film material and then transferred onto the layered structure and interconnected.
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