Interdigitated leads-over-chip lead frame, device, and method for supporting an integrated circuit die

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5977616
SERIAL NO

09141002

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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An inventive Leads-Over-Chip (LOC) lead frame includes an assembly of interdigitated leads constructed to overlie double-sided adhesive tape on the front-side surface of an integrated circuit (IC) die. An attachment surface of each lead is adhesively attachable to the tape, and at least some of the leads are constructed to extend across the front-side surface of the die from one edge substantially to another edge, such as an adjacent or opposing edge. As a result, a substantial area of the front-side surface of the die is adhesively attachable to the leads through the tape, so the die is supportable in an IC package in an improved manner, and the heat may be conducted away from the die through the lead frame in an improved manner.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
MICRON TECHNOLOGY, INC.BOISE, ID19162

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Brooks, Jerry M Caldwell, ID 183 5586
Schoenfeld, Aaron Boise, ID 52 1038

Cited Art Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (3)
* 4862245 Package semiconductor chip 560 1988
* 5086018 Method of making a planarized thin film covered wire bonded semiconductor package 118 1991
* 5780925 Lead frame package for electronic devices 137 1995
 
TAMIRAS PER PTE. LTD., LLC (1)
* 5804870 Hermetically sealed integrated circuit lead-on package configuration 69 1995
 
NATIONAL SEMICONDUCTOR CORPORATION (2)
* 5585667 Lead frame for handling crossing bonding wires 20 1994
* 5523617 Fuse frames, programmable fuse frames, and methods for programming by fusing 36 1994
 
IBIDEN CO., LTD. (1)
* 5438478 Electronic component carriers and method of producing the same as well as electronic devices 70 1993
 
OVID DATA CO. LLC (2)
* 5528075 Lead-on-chip integrated circuit apparatus 44 1995
* 5585668 Integrated circuit package with overlapped die on a common lead frame 54 1996
 
FREESCALE SEMICONDUCTOR, INC. (2)
* 5147815 Method for fabricating a multichip semiconductor device having two interdigitated leadframes 163 1991
* 5381036 Lead-on chip semiconductor device having peripheral bond pads 35 1993
 
MICRON TECHNOLOGY, INC. (4)
* 4949161 Interdigitized leadframe strip 32 1988
* 5218168 Leads over tab 30 1991
* 5256598 Shrink accommodating lead frame 78 1992
* 5360992 Two piece assembly for the selection of pinouts and bond options on a semiconductor device 76 1994
 
ELPIDA MEMORY, INC. (1)
* 5327009 Miniaturized integrated circuit package 34 1993
 
TEXAS INSTRUMENTS INCORPORATED (5)
* 5331200 Lead-on-chip inner lead bonding lead frame method and apparatus 66 1992
* 5384488 Configuration and method for positioning semiconductor device bond pads using additional process layers 147 1993
* 5434106 Integrated circuit device and method to prevent cracking during surface mount 43 1994
* 5521426 Reduced capacitance lead frame for lead on chip package 45 1994
* 5563443 Packaged semiconductor device utilizing leadframe attached on a semiconductor chip 77 1995
 
SAMSUNG ELECTRONICS CO., LTD. (1)
* 5250840 Semiconductor lead frame with a chip having bonding pads in a cross arrangement 46 1993
 
MITSUBISHI DENKI KABUSHIKI KAISHA (2)
* 4937656 Semiconductor device 71 1988
* 5303120 Method of manufacturing inversion type IC's and IC module using same 29 1992
 
KABUSHIKI KAISHA TOSHIBA (1)
* 5612259 Method for manufacturing a semiconductor device wherein a semiconductor chip is mounted on a lead frame 53 1995
 
FUJITSU LIMITED (1)
* 5530292 Semiconductor device having a plurality of chips 68 1992
 
FUJITSU SEMICONDUCTOR LIMITED (1)
* 5508565 Semiconductor device having a plurality of chips having identical circuit arrangement sealed in package 126 1994
 
SAINT-GOBAIN NORTON INDUSTRIAL CORPORATION (1)
* 5696665 Integrated circuit package with diamond heat sink 31 1996
 
Kyushu Fujitsu Electronics Limited (1)
* 5637915 Semiconductor device affixed to an upper and a lower leadframe 49 1996
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
Other [Check patent profile for assignment information] (1)
* 2003/0193,081 Interdigitated leads-over-chip lead frame and device for supporting an integrated circuit die 0 2003
 
MICRON TECHNOLOGY, INC. (1)
6831353 Interdigitated leads-over-chip lead frame and device for supporting an integrated circuit die 2 2003
 
RENESAS ELECTRONICS CORPORATION (1)
* 6518652 Semiconductor package 4 2001
 
NEC ELECTRONICS CORPORATION (1)
* 6268652 CSP type semiconductor device with reduced package size 7 1998
* Cited By Examiner