US Patent No: 5,977,616

Number of patents in Portfolio can not be more than 2000

Interdigitated leads-over-chip lead frame, device, and method for supporting an integrated circuit die

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Importance

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Abstract

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An inventive Leads-Over-Chip (LOC) lead frame includes an assembly of interdigitated leads constructed to overlie double-sided adhesive tape on the front-side surface of an integrated circuit (IC) die. An attachment surface of each lead is adhesively attachable to the tape, and at least some of the leads are constructed to extend across the front-side surface of the die from one edge substantially to another edge, such as an adjacent or opposing edge. As a result, a substantial area of the front-side surface of the die is adhesively attachable to the leads through the tape, so the die is supportable in an IC package in an improved manner, and the heat may be conducted away from the die through the lead frame in an improved manner.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
MICRON TECHNOLOGY, INC.BOISE, ID21560

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Brooks, Jerry M Caldwell, ID 228 4818
Schoenfeld, Aaron Boise, ID 61 937

Cited Art Landscape

Patent Info (Count) # Cites Year
 
TEXAS INSTRUMENTS INCORPORATED (5)
5,331,200 Lead-on-chip inner lead bonding lead frame method and apparatus 64 1992
5,384,488 Configuration and method for positioning semiconductor device bond pads using additional process layers 143 1993
5,434,106 Integrated circuit device and method to prevent cracking during surface mount 41 1994
5,521,426 Reduced capacitance lead frame for lead on chip package 43 1994
5,563,443 Packaged semiconductor device utilizing leadframe attached on a semiconductor chip 77 1995
 
MICRON TECHNOLOGY, INC. (4)
4,949,161 Interdigitized leadframe strip 32 1988
5,218,168 Leads over tab 30 1991
5,256,598 Shrink accommodating lead frame 78 1992
5,360,992 Two piece assembly for the selection of pinouts and bond options on a semiconductor device 74 1994
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (3)
4,862,245 Package semiconductor chip 532 1988
5,086,018 Method of making a planarized thin film covered wire bonded semiconductor package 118 1991
5,780,925 Lead frame package for electronic devices 124 1995
 
OVID DATA CO. LLC (3)
5,528,075 Lead-on-chip integrated circuit apparatus 43 1995
5,804,870 Hermetically sealed integrated circuit lead-on package configuration 69 1995
5,585,668 Integrated circuit package with overlapped die on a common lead frame 54 1996
 
FREESCALE SEMICONDUCTOR, INC. (2)
5,147,815 Method for fabricating a multichip semiconductor device having two interdigitated leadframes 161 1991
5,381,036 Lead-on chip semiconductor device having peripheral bond pads 35 1993
 
MITSUBISHI DENKI KABUSHIKI KAISHA (2)
4,937,656 Semiconductor device 71 1988
5,303,120 Method of manufacturing inversion type IC's and IC module using same 28 1992
 
NATIONAL SEMICONDUCTOR CORPORATION (2)
5,585,667 Lead frame for handling crossing bonding wires 20 1994
5,523,617 Fuse frames, programmable fuse frames, and methods for programming by fusing 35 1994
 
ELPIDA MEMORY, INC. (1)
5,327,009 Miniaturized integrated circuit package 33 1993
 
FUJITSU LIMITED (1)
5,530,292 Semiconductor device having a plurality of chips 67 1992
 
FUJITSU SEMICONDUCTOR LIMITED (1)
5,508,565 Semiconductor device having a plurality of chips having identical circuit arrangement sealed in package 122 1994
 
IBIDEN CO., LTD. (1)
5,438,478 Electronic component carriers and method of producing the same as well as electronic devices 58 1993
 
KABUSHIKI KAISHA TOSHIBA (1)
5,612,259 Method for manufacturing a semiconductor device wherein a semiconductor chip is mounted on a lead frame 44 1995
 
Kyushu Fujitsu Electronics Limited (1)
5,637,915 Semiconductor device affixed to an upper and a lower leadframe 45 1996
 
SAINT-GOBAIN/NORTON INDUSTRIAL CERAMICS CORPORATION (1)
5,696,665 Integrated circuit package with diamond heat sink 30 1996
 
SAMSUNG ELECTRONICS CO., LTD. (1)
5,250,840 Semiconductor lead frame with a chip having bonding pads in a cross arrangement 45 1993

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
MICRON TECHNOLOGY, INC. (1)
6,831,353 Interdigitated leads-over-chip lead frame and device for supporting an integrated circuit die 2 2003
 
NEC ELECTRONICS CORPORATION (1)
6,268,652 CSP type semiconductor device with reduced package size 7 1998
 
RENESAS ELECTRONICS CORPORATION (1)
6,518,652 Semiconductor package 4 2001