Importance

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Abstract

A probe structure containing a contact part (2) formed on one side (1a) of an insulating substrate (1), a conductive circuit (3) formed on the other side (1b) of the insulating substrate (1), wherein the contact part (2) and the conductive circuit (3) are connected via a conductive path (5) formed in a through-hole (4) in the thickness direction of the insulating substrate (1). The contact part (2) has a structure containing a deep layer (1c) having a hardness of 100-700 Hk, an intermediate layer (1b) having a hardness of 10-300 Hk, and a surface layer (1a) having a hardness of 700-1200 Hk successively laminated. The surface layer (1a) preferably has a tensile stress of not more than 50 kg/mm.sup.2. The probe structure maintains low and stable contact resistance in an electric test, in particular a burn-in test, of small test objects such as IC. In a test method wherein a solder bump is formed in a test object and utilized, the solder component of the test object does not adhere to the contact part (2) after testing. The probe structure suffers less from deterioration of contact state after repetitive open/close contact with the test object as compared to the initial contact state, and highly reliable electric testing can be performed.

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