Fabrication method of multilayer printed wiring board
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 9, 1999
Grant Date -
N/A
app pub date -
Mar 23, 1998
filing date -
Mar 24, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A fabrication method of a multilayer PWB is provided, which realizes a satisfactorily-high adhesion strength between a mounting pad and a cured resin of a prepreg layer located in a surface via hole. A first surface via hole is formed in a first subboard, and a second surface via hole is formed in a second subboard. Then, the first and second subboards are laminated together while placing an inner structure including a prepreg layer between the first and second subboards. The first and second surface via holes are filled with a resin contained in the prepreg layer. Filler particles are buried into first and second surface regions of the resin which are located in the first and second surface via holes, respectively. The filler particles buried into the first and second surface regions of the resin are removed by dissolving the filler particles, thereby roughening the first and second surface regions of the resin. First and second mounting pads are formed to be contacted with the roughened first and second surface regions of the resin, respectively.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully