Support frame and stencil having flexible end regions for attachment to the support frame
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United States of America Patent
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-
Nov 9, 1999
Grant Date -
N/A
app pub date -
Aug 26, 1997
filing date -
Jun 3, 1992
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A stencil of sheet metal for enabling solder paste to be applied to circuit boards includes a main body portion and opposite side regions which are apertured so as to be more flexible than the main body portion, and so as to enable these opposite side regions to be bent without kinking or other deformation during tensioning. The invention further includes an apparatus for enabling solder paste to be applied to a circuit board by a stenciling process, the apparatus including a stencil as described together with a support therefor, the stencil being attached to the support and being detachable therefrom. The side regions of the stencil are flexed for attachment to the support, so that the interconnection between the support and the stencil does not project beneath a lowermost planar surface of the stencil.
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