Ultrasonic bonding head comprising a linear motor for adjusting the pressure according to a piezo detector
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United States of America Patent
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Nov 9, 1999
Grant Date -
N/A
app pub date -
Jun 17, 1997
filing date -
Feb 6, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A bonding head is provided for a wire bonding machine which comprises a capillary connected to a transducer for applying pressure and ultrasonic energy to a wire guided into contact with a surface to which a wire bond is to be formed. The transducer is biased by a spring mounted at one end to a linear motor for adjustment of the urging force of the spring. The actual force applied to the wire is measured by detecting means. Control means are provided which are connected to the linear motor for adjusting the urging force of the spring, to thereby obtain a desired pressure to be applied to the wire.
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