Method and apparatus for fabricating semiconductor devices

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United States of America Patent

PATENT NO 5981399
SERIAL NO

08894308

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Abstract

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A semiconductor device fabrication apparatus having multiple processing chambers for different processes, where a substrate is carried in and out in a sophisticated manner, with their different internal ambient conditions being retained, so that the substrate is free from contamination, thereby manufacturing high-quality semiconductor devices at high throughput. The apparatus includes a movable buffer chamber having a wafer carriage means within a transfer chamber which faces a process chamber, an evacuation means which evacuates of gas the buffer chamber, transfer chamber and process chamber independently, a gas feed means, and a control means.

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Patent Owner(s)

Patent OwnerAddress
RENESAS ELECTRONICS CORPORATION2-24 TOYOSU 3-CHOME KOUTOU-KU TOKYO 135-0061

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hidaka, Minoru Kodaira, JP 15 446
Kawamoto, Yoshifumi Kanagawa-ken, JP 43 1622
Kawamura, Yoshio Kokubunji, JP 48 2888
Matsui, Miyako Kokubunji, JP 14 210
Moriyama, Shigeo Tama, JP 47 1878
Uchida, Fumihiko Hachioji, JP 17 553
Yamamoto, Tatuharu Higashi-murayam, JP 4 475
Yokoyama, Natsuki Mitaka, JP 74 1473

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