Thin film capacitor coupons for memory modules and multi-chip modules

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United States of America Patent

PATENT NO 5982018
SERIAL NO

08862726

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Abstract

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A semiconductor device including a thin coupon capacitor mounted to the backside of a semiconductor die. When mounted active surface up on a carrier substrate of a multi-chip module, the coupon is secured between the backside of the die and the substrate. When flip-chip connections or direct chip attach are employed between the die and substrate, the coupon is secured to the backside of the die. The coupons may be preformed, or formed on the die in a wafer-scale fabrication process prior to singulation of the dice.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
MICRON TECHNOLOGY, INC.BOISE, ID19086

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akram, Salman Boise, ID 797 27766
Wark, James M Boise, ID 181 5024

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