Thin film capacitor coupons for memory modules and multi-chip modules

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5982018
SERIAL NO

08862726

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A semiconductor device including a thin coupon capacitor mounted to the backside of a semiconductor die. When mounted active surface up on a carrier substrate of a multi-chip module, the coupon is secured between the backside of the die and the substrate. When flip-chip connections or direct chip attach are employed between the die and substrate, the coupon is secured to the backside of the die. The coupons may be preformed, or formed on the die in a wafer-scale fabrication process prior to singulation of the dice.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddressTotal Patents
MICRON TECHNOLOGY, INC.BOISE, ID19209

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akram, Salman Boise, ID 792 26916
Wark, James M Boise, ID 180 4858

Cited Art Landscape

Patent Info (Count) # Cites Year
 
Other [Check patent profile for assignment information] (1)
* 5103283 Packaged integrated circuit with in-cavity decoupling capacitors 68 1990
 
ADVANCED MICRO DEVICES, INC. (1)
* 5063432 Integrated circuit lead assembly structure with first and second lead patterns spaced apart in parallel planes with a part of each lead in one lead pattern perpendicular to a part of each lead in the other lead pattern 10 1990
 
MICRON TECHNOLOGY, INC. (6)
* 4879631 Short-resistant decoupling capacitor system for semiconductor circuits 40 1989
* 5155656 Integrated series capacitors for high reliability electronic applications including decoupling circuits 18 1991
* 5266821 Chip decoupling capacitor 76 1992
* 5329237 Method and system for decoupling inoperative passive elements on a semiconductor chip 19 1993
* 5304506 On chip decoupling capacitor 43 1993
* 5307309 Memory module having on-chip surge capacitors 51 1993
 
SGS-THOMSON MICROELECTRONICS, INC. (1)
* 5283717 Circuit assembly having interposer lead frame 68 1992
 
SAMSUNG ELECTRONICS CO., LTD. (3)
* 5010387 Solder bonding material 14 1988
* 5140496 Direct microcircuit decoupling 43 1991
* 5099306 Stacked tab leadframe assembly 37 1991
 
FAIRCHILD SEMICONDUCTOR CORPORATION (1)
* 4680613 Low impedance package for integrated circuit die 131 1983
 
FUJITSU LIMITED (1)
* 4984059 Semiconductor device and a method for fabricating the same 151 1983
 
STAKTEK GROUP L.P. (1)
* 5498906 Capacitive coupling configuration for an intergrated circuit package 27 1993
 
MOTOROLA, INC. (1)
* 5212402 Semiconductor device with integral decoupling capacitor 70 1992
 
LINEAR TECHNOLOGY CORPORATION (1)
* 5444600 Lead frame capacitor and capacitively-coupled isolator circuit using the same 35 1992
 
STOVOKOR TECHNOLOGY LLC (1)
* 5403784 Process for manufacturing a stacked multiple leadframe semiconductor package using an alignment template 48 1993
 
CIRCUIT COMPONENTS, INCORPORATED (3)
* 4994936 Molded integrated circuit package incorporating decoupling capacitor 56 1990
* 5272590 Integrated circuit package having an internal cavity for incorporating decoupling capacitor 67 1990
* 5095402 Internally decoupled integrated circuit package 114 1990
 
INTEL CORPORATION (1)
* 5369545 De-coupling capacitor on the top of the silicon die by eutectic flip bonding 59 1993
 
INTERSIL CORPORATION (1)
* 5228192 Method of manufacturing a multi-layered IC packaging assembly 34 1992
 
TEXAS INSTRUMENTS INCORPORATED (1)
* 5200364 Packaged integrated circuit with encapsulated electronic devices 54 1992
 
AMP Incorporated (1)
* 4410905 Power, ground and decoupling structure for chip carriers 77 1981
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
QUALCOMM INCORPORATED (4)
9018774 Chip package 2 2008
8748227 Method of fabricating chip package 0 2008
8426982 Structure and manufacturing method of chip scale package 1 2009
8912666 Structure and manufacturing method of chip scale package 0 2013
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (2)
* 7645675 Integrated parallel plate capacitors 6 2006
* 2007/0190,760 INTEGRATED PARALLEL PLATE CAPACITORS 13 2006
 
Other [Check patent profile for assignment information] (5)
* 2006/0231,863 MANUFACTURING PROCESS OF A CHIP PACKAGE STRUCTURE 0 2006
* 2007/0150,635 Memory System Having Memory Devices on Two Sides 7 2007
* 2007/0150,636 Memory Module Having a Clock Line and Termination 7 2007
* 2007/0156,943 Memory Module Having a Clock Line and Termination 7 2007
* 2007/0216,800 Memory System Having a Clock Line and Termination 7 2007
 
VIA TECHNOLOGIES, INC. (2)
* 2004/0155,357 [CHIP PACKAGE STRUCTURE AND MANUFACTURING PROCESS THEREOF] 4 2003
* 7622326 Manufacturing process of a chip package structure 0 2006
 
U.S. BANK NATIONAL ASSOCIATION (2)
* 2004/0212,083 Method to prevent die attach adhesive contamination in stacked chips 18 2004
* 2004/0212,082 Method to prevent die attach adhesive contamination in stacked chips 1 2004
 
OUME ELECTRONICS CO., LTD. (1)
* 6847066 Semiconductor device 48 2001
 
MICRON TECHNOLOGY, INC. (13)
* 6251702 Use of an oxide surface to facilitate gate break on a carrier substrate for a semiconductor device 4 1999
6710454 Adhesive layer for an electronic apparatus having multiple semiconductor devices 36 2000
* 6342724 Thin film capacitor coupons for memory modules and multi-chip modules 33 2000
6404069 Use of oxide surface to facilitate gate break on a carrier substrate for a semiconductor device 4 2001
6545368 Use of an oxide surface to facilitate gate break on a carrier substrate for a semiconductor device 2 2002
* 2004/0104,486 Electronic apparatus having an adhesive layer from wafer level packaging 4 2003
7224070 Plurality of semiconductor die in an assembly 17 2004
7078264 Stacked semiconductor die 21 2004
7943422 Wafer level pre-packaged flip chip 6 2006
7812447 Wafer level pre-packaged flip chip 4 2006
7808112 Wafer level pre-packaged flip chip system 6 2006
7646102 Wafer level pre-packaged flip chip systems 60 2006
* 2008/0054,429 Spacers for separating components of semiconductor device assemblies, semiconductor device assemblies and systems including spacers and methods of making spacers 7 2006
 
GLOBALFOUNDRIES INC. (1)
* 6364669 Spring contact for providing high current power to an integrated circuit 2 2000
 
SAMSUNG ELECTRONICS CO., LTD. (1)
* 6180976 Thin-film capacitors and methods for forming the same 87 1999
 
INTEGRA TECHNOLOGIES, INC. (1)
* 6331931 Radio frequency power device improvement 11 2000
 
RAMBUS INC. (10)
* 7085872 High frequency bus system 1 2001
* 2005/0246,471 High frequency bus system 0 2001
* 2004/0221,083 High frequency bus system 3 2001
7523244 Memory module having memory devices on two sides 6 2006
7523246 Memory system having memory devices on two sides 1 2007
7523247 Memory module having a clock line and termination 0 2007
7519757 Memory system having a clock line and termination 0 2007
7870322 Memory module having signal lines configured for sequential arrival of signals at synchronous memory devices 1 2009
8214575 Memory module having signal lines configured for sequential arrival of signals at synchronous memory devices 0 2010
8364878 Memory module having signal lines configured for sequential arrival of signals at a plurality of memory devices 0 2012
 
SPREADTRUM COMMUNICATIONS CORPORATION (1)
* 2004/0226,735 Method and apparatus for integrated noise decoupling 4 2003
 
FUJITSU LIMITED (1)
* 6891247 Semiconductor device including semiconductor bare chip mounted by flip-chip bonding, and board member with thin-film structure capacitor for semiconductor bare chip mounted by flip-chip bonding 1 2002
 
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (1)
* 6683781 Packaging structure with low switching noises 8 2002
 
X2Y ATTENUATORS, LLC (7)
8547677 Method for making internally overlapped conditioners 3 2011
9036319 Arrangement for energy conditioning 1 2011
8587915 Arrangement for energy conditioning 3 2011
9054094 Energy conditioning circuit arrangement for integrated circuit 12 2011
9001486 Internally overlapped conditioners 0 2013
9019679 Arrangement for energy conditioning 0 2013
9373592 Arrangement for energy conditioning 0 2015
 
INFINEON TECHNOLOGIES AG (1)
* 6215171 IC module 3 2000
 
SKYWORKS SOLUTIONS, INC. (2)
* 7164192 Semiconductor die package with reduced inductance and reduced die attach flow out 5 2003
* 2004/0155,332 Semiconductor die package with reduced inductance and reduced die attach flow out 1 2003
 
AOI ELECTRONICS CO., LTD. (1)
6545354 Semiconductor device having a barrier layer 89 2000
 
INTEL CORPORATION (4)
* 6657275 Pad and via placement design for land side capacitors 4 1999
6492843 Random frequency clock generator 3 2000
* 6385033 Fingered capacitor in an integrated circuit 57 2000
6812566 Lower profile package with power supply in package 2 2002
 
Ultrasource, Inc. (8)
6761963 Integrated thin film capacitor/inductor/interconnect system and method 21 2001
6998696 Integrated thin film capacitor/inductor/interconnect system and method 8 2003
6890629 Integrated thin film capacitor/inductor/interconnect system and method 10 2003
7327582 Integrated thin film capacitor/inductor/interconnect system and method 6 2005
* 2005/0175,938 Integrated thin film capacitor/inductor/interconnect system and method 3 2005
7425877 Lange coupler system and method 1 2005
7446388 Integrated thin film capacitor/inductor/interconnect system and method 6 2005
* 2006/0097,344 Integrated thin film capacitor/inductor/interconnect system and method 0 2005
 
TERAMIKROS, INC. (1)
RE41511 Semiconductor device having a thin-film circuit element provided above an integrated circuit 0 2007
 
MITSUBISHI DENKI KABUSHIKI KAISHA (4)
* 6362523 Semiconductor device 8 1999
* 6940155 IC package, optical transmitter, and optical receiver 0 2002
* 2003/0122,228 IC package, optical transmitter, and optical receiver 6 2002
6963123 IC package, optical transmitter, and optical receiver 2 2003
 
MINCO TECHNOLOGY LABS, INC. (1)
* 6406938 Semiconductor and flip chip packages and method having a back-side connection 7 2000
 
CASIO COMPUTER CO., LTD. (1)
6870256 Semiconductor device having a thin-film circuit element provided above an integrated circuit 16 2002
* Cited By Examiner